Polyimide (PI) is an aromatic heterocyclic polymer compound with imide chain segments in its molecular structure. It is one of the most heat-resistant types of engineering plastics currently available and is widely used in aviation, aerospace, microelectronics, nanotechnology, liquid crystal, laser and other fields.
Recently, all countries have included the research, development and utilization of PI as one of the development priorities of new chemical materials in the 21st century. Polyimide, due to its outstanding characteristics in performance and synthesis, has great application prospects whether as a structural material or as a functional material.
Polyimide is known as the top material of the pyramid of polymer materials, and is also known as a "problem solver". Some industry insiders even believe that "without polyimide, there would be no microelectronics technology today."
Due to its excellent performance, polyimide can be applied to a variety of fields and can also be divided into a variety of types, including engineering plastics, fibers, photosensitive polyimide, foam materials, coatings, adhesives, films, aerogels, composite materials, etc.